Global Electronic Packaging Market – Size, Outlook, Trends and Forecast (2024 – 2032)

Published : 30 Aug 2024
Report Type : Global

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Global Electronic Packaging Market - Size
Study Period
2018 - 2030
Base Year For Estimation
2024
Forecast Data Period
2025-2030
Historical Data Period
2018-2023
CAGR
7 %
Source: Envision Intelligence Analysis & Experts Insights.
*Graph shown for illustrative purpose only, the final report will have the graph with actual data and data labels

Electronic Packaging is also known as a technology for packing electronic equipment. It refers to inserting discrete components, MSI and LSI chips, and integrated circuits into plates through holes on multilayer circuit boards, and also it includes a wide variety of technologies.

Global Electronic Packaging Market Share:

Asia-Pacific excluding Japan has the highest market share of 36.7% among all the regions, and it is expected to grow at a high rate.

Global Electronic Packaging Market Size:

The Electronic Packaging Market is expected to reach USD 1207.45 Million at a CAGR of 18.8% during the forecast period 2018-2024.

Asia-Pacific followed by North America; Western Europe has the most significant regional market size for electronic packaging during the forecast period.

Global Electronic Packaging Market Growth:

There is a rapid

Global Electronic Packaging Market - Growth
Source: Envision Intelligence Analysis & Experts Insights.
*Graph shown for illustrative purpose only, the final report will have the graph with actual data and data labels
growth in the Global Internet of things, in turn, it is boosting the global market demand for efficient, all-weather packaging for consumer electronics products.

Global Electronic Packaging Market Industry Analysis:

Electronic Packaging is segmented by Technology(EAS, RFID), by Functions which includes Audio/Timer, Health, Scroll/Page Turn, Status, Wink/Decal, and other consumer Packaged Goods.

Global Electronic Packaging Market Outlook:

Manufacturers need to focus on protective packaging products such as air pillows, air bubble wraps, and other inflatable packaging products that can protect consumer electronics products from harsh weather conditions, electrostatic discharge, water, dust, and corrosion.

Global Electronic Packaging Market Trends:

BASF signs an agreement to acquire significant parts of Bayer’s seed and non-selective herbicide business. Mead Westvaco Corporation’s and office products business merges with ACCO Brands Corporation.

Global Electronic Packaging Research Report Includes:

  • An executive summary condensing the whole report such that essential authority can rapidly twist up doubtlessly acquainted with brief overview and conclusion.
  • To have complete market analysis through industry value chain analysisPorter’s fivePESTLESWOT analysis, and Y-o-Y analysis.
  • Regional and global diversity is analysed with the major countries and the unions. Scrutinizing the revenue generation on YearOnYear
  • Identifying DROC in the current market and their impact in altering the market dynamics.
  • Competitive landscape analysis to identify the merger and acquisition which will have a comparative financial study with significant competitors.
  • Expertise investment opportunities by an analyst to the individual and organisation to have the better foothold in the market.
  • Identify the latest developments, market shares and strategies that are employed by the major market players, such as
  • Solige
  • T-INK
  • Cymbett
  • Excellatron Solid State
  • Holst Centre
ACCO Brands Corporation. Global

You can also purchase parts of this report. Do you want to check out a section wise price list

Global Electronic Packaging Market - Porter's Five Force Analysis
Source: Envision Intelligence Analysis & Experts Insights.
*Graph shown for illustrative purpose only, the final report will have the graph with actual data and data labels

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